Yes this is all correct. Problem is loose BGAs due to a manufacturing issue. Once these come loose, you most likely will not get them to reseat due to oxidation of pads on IC since they were never tinned. Don't try to remove heatsinks or you will probably tear IC in half of cause severe trace damage to pcb. Not like it matters at this point I guess. Its not a thermal problem. You need to start thinking about either replacing the CPU bd from a local sale / vendor or just collect ROM bds to swap onto you PH unit. I say local because you most likely will not be able to purchase one and have it shipped without breaking. I was the last one taking these sets in for repair. I recently stopped because every one one for one was breaking in transit.