andykmv
Active member
...with an epoxy cap it works just as well. The trick is to put as much on the cap as possible without getting any on top of the finger itself. Then carefully sand it back...
i am interested in repairing my pacman pcbs using this technique and am wondering about the following issues:
In your first picture, how did you overlap the foil trace ? it looks like it could be one of two possible approaches:
overlap1 --\
----------- \------\ added foil, starting with overlap on original trace, running to the edge of edge connector
===============
overlap2 -------
----------- ------\ added foil with a seperate piece soldered on top ovelapping both original trace and new foil trace
===============
Epoxy type used for substrate repair: I was thinking of needing to use an epoxy with a hig temperature tolerance such as would occur during soldering (ie 360 degrees centrigrade / 680 F ?) What sort/brand/model of epoxy did you use ? and what did you use for colorant ?
[some epoxy available in hardware shops in aus tend to soften above 60 deg C/140 F, such as might occur when a connection is dirty or arcing]
Adhering the foil to the substrate: I was thinking of using the same epoxy to adhere the foil to the substrate. Have you relied on adhesive backing on the foil to adhere the foil to the substrate ?
If not, what did you use to adhere the foil to the substrate ?
[One AussieArcade forum member noted a pcb purchased from EU prob relied on adhesive backing as the foil peeled back after a few insertions/removals of the card edge connector]
Cheers!
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